Analog Devices Strengthens Capacity and Resiliency Through Expanded Partnership with TSMC
Special arrangement through JASM secures ADI's long-term chip supply and focuses on 40nm and finer process technology nodes
Building on ADI's more than 30-year partnership with TSMC, this adds another option for ADI to secure additional capacity of fine-pitch technology nodes to serve critical platforms across its business, including wireless BMS (wBMS) and Gigabit Multimedia Serial Link (GMSL™) applications. The joint efforts reinforce ADI's resilient hybrid manufacturing network, which helps to insulate external factors while supporting the means to increase output and scale rapidly to meet customer needs.
"Our hybrid manufacturing network helps deliver a competitive edge to our customers. Together with TSMC, we can serve our customers with more resilient supplies, respond even more rapidly to customer needs and changing market conditions, and focus our investments on innovative manufacturing solutions that benefit society and the planet," said
"Today's announcement demonstrates TSMC's commitment to helping our customers meet their long-term capacity needs," said
For more information about ADI's resilient hybrid manufacturing network, visit https://www.analog.com/en/who-we-are/resilient-hybrid-manufacturing.html.
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Forward-Looking Statements
This press release contains forward-looking statements, which address a variety of subjects including, for example, our statements regarding our long-term wafer capacity supply arrangement with TSMC and JASM; our hybrid manufacturing network; and other future events. Statements that are not historical facts, including statements about our beliefs, plans and expectations, are forward-looking statements. Such statements are based on our current expectations and are subject to a number of factors and uncertainties, which could cause actual results to differ materially from those described in the forward-looking statements. The following important factors and uncertainties, among others, could cause actual results to differ materially from those described in these forward-looking statements: economic, political, legal and regulatory uncertainty or conflicts; changes in demand for semiconductor products; manufacturing delays, product and raw materials availability and supply chain disruptions; products that may be diverted from our authorized distribution channels; changes in export classifications, import and export regulations or duties and tariffs; our development of technologies and research and development investments; our future liquidity, capital needs and capital expenditures; our ability to compete successfully in the markets in which we operate; and security breaches or other cyber incidents. For additional information about factors that could cause actual results to differ materially from those described in the forward-looking statements, please refer to our filings with the
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CONTACTS: Ferda Millan, Global PR and External Communications, Analog Devices, Ferda.Millan@analog.com, (408) 373-1854; Michael Lucarelli, Vice President, Investor Relations and FP&A, Analog Devices, Investor.Relations@analog.com, (781) 461-3282